Bambu Lab Bambu Cool Plate
- Order number: FAP001-3
- EAN: 6975337030768
- commodity code: 84779080
Things to know before use
- Variations in the colour and gloss of the Engineering Plate's appearance and the removal of exposed metal areas are only minor adjustments to optimise the production process and surface quality. If the coating remains on the nozzle when the nozzle is wiped, it is heated and melted before the model is printed. Such changes have no effect on levelling, lidar, adhesion or application area. You can buy with confidence!
- Before automatic levelling, it is necessary to rub the nozzle repeatedly in the special wiping area of the build plate to completely remove all material residues at the nozzle tip. The coating in the specially developed wiping area gradually wears off over time. This is normal and has no effect on print quality or nozzle life, so there is no need to worry about quality issues.
- Bambu Lab recommends using only the official Bambu Lab adhesive on the Cool Plate and cannot be held liable for any damage to the plates caused by the use of third party adhesives on the build plate
One side: Bambu Cool Plate= Cool plate sheet + Bambu Engineering Plate
The other side: Bambu Engineering Plate
1. Bambu Cool Plate
Please note that other slicer settings might need to be adjusted based on the printed model and the filament requirements
| Material | Heatbed Temperature | Glue Stick Required? | Upper Glass Cover Plate Removed? |
| PLA/PLA-CF/PLA-GF | 35~45℃ | Yes | Either |
| TPU | 30~35℃ | Yes | Either |
| PVA | 35~45℃ | Yes | Either |
Benefits
Works best with low glass transition temperature filaments as it can be used at a low temperature for the heatbed
Works well with the Automatic Calibration for Flow rate and does not interfere with the LIDAR
Smooth texture on the surface of the print
Excellent adhesion and easy print removal
Can be replaced by the user
Downsides
Cannot be used without glue stick as the surface can be easily damaged if glue stick is not used
It is not recommended for high-temperature materials as bubbles can form underneath the print surface and cause damage
Can be more fragile compared to the Engineering Plate or Textured PEI Plate
2. Bambu Engineering Plate
Please note that other slicer settings might need to be adjusted based on the printed model and the filament requirements
| Material | Heatbed Temperature | Glue Stick Required? | Upper Glass Cover Plate Removed? |
| TPU | 30~35℃ | Recommended | No |
| PETG | 70~80℃ | Recommended | Yes |
| ABS | 100~110℃ | Yes | No |
| PC/PC-CF | 100~110℃ | Yes | No |
| PA/PA-CF/PATH-CF | 100~110℃ | Yes | No |
| Especially for: | Bambu Lab P1S Series, Bambu Lab X1 Series |
